A report says TSMC is drafting memory chips for Nvidia. TSMC talked about logic

The Information reported on 6 November that TSMC recently began drafting plans to produce 3D DRAM, a stacked memory chip, at the request of Nvidia, its largest customer. The account cited two people with direct knowledge. Bloomberg and others carried it as The Information’s report. The same account, as later write-ups describe it, says TSMC could build new factories or buy a plant and convert it, and that the timing of any production is unclear. Drafting is not a wafer.

TSMC and Nvidia did not immediately answer Reuters. A spokesperson did answer Tom’s Hardware. The words were that TSMC “focuses on our core business at all times, which is dedicated IC foundry,” and that its mission is to be the trusted provider for the “global logic IC industry for years to come.” Tom’s Hardware read that as a denial. The sentences do not say the word DRAM, and they do not say a draft was not started. A mission statement and a newspaper report can both be on the page. Neither is a factory that has changed what it makes. The report, as relayed, puts the work with Hsu Kuo-chin, the vice president for advanced packaging. That name is in the account. It is not in a TSMC release.